Thinfilm, Bemis agree to develop Intelligent Packaging Platform

July 25, 2012
Thin Film Electronics ASA (Thinfilm) and Bemis Company Inc recently announced an agreement to develop a flexible sensing platform for the packaging market.

Thin Film Electronics ASA (Thinfilm) and Bemis Company Inc recently announced an agreement to develop a flexible sensing platform for the packaging market. The result will be a new category of packaging that can collect and wirelessly communicate sensor information, for use by food, consumer products, and healthcare companies worldwide.

Thinfilm has previously announced technology partnerships to develop an inexpensive, integrated time-temperature sensor for use in monitoring perishable goods and pharmaceuticals. Under the agreement with Bemis, the firm will extend this work to create a customizable sensor platform that Bemis will subsequently tailor to its customers’ individual requirements. The Intelligent Packaging Platform can be adapted to monitor and record key physical properties and environmental data in packaged perishable products.

Bemis’ packaging is used for a range of products from meat and cheese to medical devices and personal care items. Its customers include food and consumer products companies around the world. The flexible packaging market for North America alone is estimated by PCI Films Consulting Ltd to be $18.3 billion.

The Intelligent Packaging Platform is expected to be commercially available in 2014. More information is available at www.bemis.com or www.thinfilm.no.

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